<p>The mounting structure of a power device is simplified so as to reduce cost while achieving improvements in heat dissipation and reliability. A power module 100 is comprised of a metal wiring board 13, a power device 11 disposed on an upper surface of the metal wiring board 13 via a solder layer 12, a metal heat dissipating plate 15 disposed on a lower surface of the metal wiring board 13, and a heat sink 19 disposed on a lower surface of the metal heat dissipating plate 15. A resin-based insulating layer 14 is disposed between any desired two of the aforementioned layers.</p>
申请公布号
EP1848036(A2)
申请公布日期
2007.10.24
申请号
EP20070105036
申请日期
2007.03.27
申请人
TOYOTA JIDOSHA KABUSHIKI KAISHA;E.I. DU PONT DE NEMOURS AND COMPANY
发明人
ATSUMI, TAKASHI;UKAI, JUNZO;ETO, KENJI;NAKAMURA, KENJI;DAIZA, SEZTO;MELONI, PAUL ARTHUR;SREERAM, ATTIGNAL N.;ROBERTS, KURT DOUGLAS;SUTTON, DAVID LEROY