发明名称 METHOD AND APPARATUS OF ALIGNING A SUBSTRATE
摘要 A method and an apparatus for aligning substrates are provided to reduce a manufacturing error of a PCB by improving an aligning accuracy of the PCB(Printed Circuit Board). A substrate(20) is loaded on a working plate(10). An electric line and an alignment mark(25) are printed on the loaded substrate. The alignment mark is used as reference information for aligning printing positions of the electric lines. The alignment mark is printed at the same time when the electric lines are printed on the substrate. The electric lines and the alignment marks are printed on the substrate by using a predetermined program.
申请公布号 KR100769529(B1) 申请公布日期 2007.10.23
申请号 KR20060090783 申请日期 2006.09.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SEO, SHANG HOON;JOUNG, JAE WOO;KIM, TAE GU;LEE, RO WOON;KIM, YONG SIK;PARK, JAE CHAN
分类号 H05K3/40 主分类号 H05K3/40
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