Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus

摘要

A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31 ), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for conducting between the wiring pattern 17 and the wiring pattern 31, wherein the polyimide 22 is disposed around the interlayer conducting post 18 using a liquid drop discharge system.