发明名称 Attaching heat sinks to printed circuit boards using preloaded spring assemblies
摘要 An integrated circuit assembly including a heat sink, a socket, a printed circuit board and a chassis to be held together under spring bias. The assembly may be secured together with less than 2 mm spanning between a printed circuit board and a chassis.
申请公布号 US7286371(B2) 申请公布日期 2007.10.23
申请号 US20050089495 申请日期 2005.03.24
申请人 INTEL CORPORATION 发明人 UNREIN ED
分类号 H05K7/02;H05K7/04 主分类号 H05K7/02
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