Moulding assembly for forming at least one protective cap

摘要

The present invention relates to a moulding assembly to form at least one protective cap for a device. The moulding assembly includes a first mould wafer including at least one first recess and a second mould wafer including at least one pair of second recesses. The second mould wafer is able to be positioned relative to the first mould wafer so that each first recess is in register with a corresponding pair of second recesses. In use, thermosplastic material is located between the first and second mould wafers; the first and second mould wafers are positioned relative to one another so that each first recess is in register with a corresponding pair of second. recesses; the thermoplastic material is heated; and the first and second mould wafers are pressed together so that heated thermosplastic material enters the first and second recesses. Each first recess and corresponding second pair of recesses thereby combine to define a mould chamber in which a respective cap is formed.