发明名称 Multilayer printed wiring board and method of manufacturing the same
摘要 A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3 % reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.
申请公布号 US7284320(B2) 申请公布日期 2007.10.23
申请号 US20050119820 申请日期 2005.05.03
申请人 TOYO KOHAN CO., LTD. 发明人 SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI
分类号 H05K3/36;H05K1/02;H05K3/06;H05K3/46 主分类号 H05K3/36
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