| 摘要 |
A method and a processing composition are provided to reduce the number of pattern collapse defect generated in the manufacturing process of a semiconductor device and to reduce line edge roughness and/or line width roughness. A processing composition comprises at least one solvent; and 10-10,000 ppm of at least one surfactant represented by the formula 1, 2, 3, 4a, 4b, 5, 7 or 8, wherein R1 and R4 are independently a C3-C10 linear or branched alkyl group; R2 and R3 are independently H or a C1-C5 alkyl group; R5 is a C1-C10 linear or branched alkyl group; W is H or an alkynyl group; m, n, p and q are independently a number of 0-20; and t is a number of 0-2.
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