COPPER CLAD LAMINATE AND METHOD OF MANUFACTURING THE SAME

摘要

A copper clad laminate and a manufacturing method thereof are provided to improve reliability by improving the roughness of a surface contacted with a core substrate through etching or oxidation treatment. A manufacturing method of a copper clad laminate by laminating a copper thin film layer(120) on one or both surfaces of a core substrate(110) includes the steps of: treating the surface of the thin film layer(120), which faces the core substrate(110), to be rough; laminating the thin film layer(120) on the core substrate(110); and heating and compressing the thin film layer(120), and fixing the thin film layer(120) on the core substrate(110). The core substrate(110) is an insulating substrate including PI or FR4.