发明名称 High-density memory module utilizing low-density memory components
摘要 A memory module comprises a plurality of memory components. Each memory component has a first bit width. The plurality of memory components are configured as one or more pairs of memory components. Each pair of memory components simulates a single virtual memory component having a second bit width which is twice the first bit width.
申请公布号 US7286436(B2) 申请公布日期 2007.10.23
申请号 US20050075395 申请日期 2005.03.07
申请人 NETLIST, INC. 发明人 BHAKTA JAYESH R.;SOLOMON JEFFREY;GERVASI WILLIAM M.
分类号 G11C8/00;G11C5/06;G11C7/00;G11C7/10 主分类号 G11C8/00
代理机构 代理人
主权项
地址