发明名称 |
High-density memory module utilizing low-density memory components |
摘要 |
A memory module comprises a plurality of memory components. Each memory component has a first bit width. The plurality of memory components are configured as one or more pairs of memory components. Each pair of memory components simulates a single virtual memory component having a second bit width which is twice the first bit width.
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申请公布号 |
US7286436(B2) |
申请公布日期 |
2007.10.23 |
申请号 |
US20050075395 |
申请日期 |
2005.03.07 |
申请人 |
NETLIST, INC. |
发明人 |
BHAKTA JAYESH R.;SOLOMON JEFFREY;GERVASI WILLIAM M. |
分类号 |
G11C8/00;G11C5/06;G11C7/00;G11C7/10 |
主分类号 |
G11C8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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