ANISOTROPIC CONDUCTIVE FILM, ELECTRONIC DEVICE, AND PACKAGING METHOD OF ELECTRONIC PARTS

摘要

An anisotropic conductive film, an electronic device, and a packaging method of electronic parts are provided to obtain low electrical resistance by metallic bonding between a molten conductive layer and an electrode pad. An anisotropic conductive film(10) includes a conductive layer(11) and an insulating adhesive layer(13). The conductive layer(11) is capable of being molten at low or high temperature and includes at least one sub layer containing conductive metal or alloy. A thickness of the conductive layer(11) is determined based on a thickness of the insulating adhesive layer(13) and a distance between electrode pads for connection. A melting point of the conductive layer(11) is desirably less than 250°C for preventing the deterioration of electronic parts. The dielectric insulating layer(13) is adhered on a plane of the conductive layer(11) and includes at least one sub layer having a resin compound. The resin compound is not completely hardened in the melting point of the conductive layer(11).