| 摘要 |
<p>A multichip package system is provided to minimize a space required in a system by reducing a height, a width, and a length of the multichip package. A multichip package system includes a first substrate(110), a first integrated circuit die(102), and a second integrated circuit die(120). The first substrate includes a first side(108), a second side(116), and a first opening(114). The first integrated circuit die(102) is connected to the first substrate(110) through the first opening. The second integrated circuit die(120) is connected on the first substrate(110). The first integrated circuit die(102) and the second integrated circuit die(120) are encapsulated on the first substrate(110). An active side of the first integrated circuit die(102) is attached on the first side. The second integrated circuit die(120) is mounted on the second side at one side of the first opening.</p> |
