发明名称 |
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING |
摘要 |
An article (205) of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article (205) of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface (510) adapted to polish the substrate and a mounting surface (530). A plurality of perforations (505) may be formed in the polishing article (205) for flow of material therethrough. In another aspect, a polishing article (205) for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
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申请公布号 |
KR20070103091(A) |
申请公布日期 |
2007.10.22 |
申请号 |
KR20077023166 |
申请日期 |
2007.10.10 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
CHEN LIANG YUH;WANG YUCHUN;WANG YAN;DUBOUST ALAIN;CARL DANIEL A.;WADENSWEILER RALPH;BIRANG MANOOCHER;BUTTERFIELD PAUL D.;MAVLIEV RASHID;TSAI STAN D. |
分类号 |
B24B37/04;B23H5/08;C25F7/00;H01L21/304 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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