| 摘要 |
<p>A substrate processing apparatus is provided to increase a freedom degree of a device in a position to stand by a slit nozzle by arranging a coating unit and a feeding unit in a direction vertical to a coating direction. A substrate processing apparatus forms a thin film on a surface of a substrate. The substrate processing apparatus includes a coating unit(10), a feeding unit, a postprocess unit. The coating unit(10) moves a slit nozzle in a coating direction to coat a surface of the substrate with a processing solution while discharging the processing solution from the slit nozzle. The feed unit feeds the substrate. The coating unit(10) and the feeding unit are disposed in a direction perpendicular to the coating direction. The feed unit includes an elevator. The elevator elevates the substrate. The postprocess unit post-processes the substrate.</p> |
