APPARATUS AND METHOD OF WAFER MAPPING

摘要

An apparatus for mapping a wafer and a method thereof are provided to prevent a collision with an abnormally protruded wafer by sensing the wafer in advance. An apparatus for mapping a wafer includes a cassette(110), a robot(100), a mapping sensor(140), and wafer protrusion sensors(160,170). A plurality of wafers are loaded on the cassette(110). The robot(100) is moved so that the cassette(110) is scanned upward and downward. The mapping sensor(140) is installed at the robot(100) and senses whether the wafers are present on the cassette(110). The wafer protrusion sensors(160,170) are installed at the robot(100) and sense whether the wafers are protruded in the cassette(110). The robot(100) includes an arm to enclose the wafers. The arm includes a first arm(120a) and a second arm(120b). The first arm(120a) is extended to a left circumference of the wafer. The second arm(120b) is extended to a right circumference of the wafer.