TEMPERATURE CONTROLLABLE WAFER CHUCK APPARATUS AND METHOD OF CONTROLLING TEMPERATURE OF THE WAFER CHUCK USING THE SAME

摘要

A temperature controllable wafer chuck apparatus and a method for controlling temperature of the wafer chuck using the same are provided to prevent degradation of a device by removing heat generated in a wafer. A temperature controllable wafer chuck apparatus includes a wafer table(20), at least one temperature sensor(30), at least one first pipe(100), at least one second pipe(200), and a temperature controller(40). A wafer is loaded on an upper surface of the wafer table(20). The temperature sensor(30) is installed on the wafer table(20) and senses a temperature of the wafer table(20). Coolant flows through an inside of at least one first pipe(100). The second pipe(200) is connected to the first pipe(100) and coolant flows through the second pipe(200). The temperature controller(40) is connected to the second pipe(200), and receives a temperature signal from the temperature sensor and controls the temperature of the wafer table(20).