HEATING APPARATUS FOR SEMICONDUCTOR WAFERS AND GLASS SUBSTRATES

摘要

A substrate heating apparatus is provided to improve the accuracy of temperature by adjusting separation distance between a heater and a heat radiating unit, thereby increasing the efficiency of operation. A heating unit has a heater(106) heating a substrate(100) and a heater chuck(104) directly transmitting the heat to the substrate. A heat radiating unit(110) radiates the heat towards a lower portion of the heater. The heat transmitted from the heater to the substrate is lowered by a substrate supporting plate(102). A support pin(108) is movable to adjust an interval of the heater chuck and the substrate supporting plate. A Z-axis ball screw(112) adjusts temperatures of the heater and the heat radiating unit by adjusting the interval.