| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for use of a light emitting element capable of improving efficiency in extracting light, and to provide a light emitting device with a large light emission quantity. <P>SOLUTION: An element mounting part A for mounting the light emitting element C is provided on an insulative substrate 4. The mounting part A consists of an element mounting part body 19 to be placed on the substrate 4 and a protrusion 14 connecting with the body 19 and protruding in a tapered manner in the thickness direction Z from one surface 13 in the thickness direction Z of the substrate 4. The light emitting element C is mounted on a mounting surface 15 at the tip in the thickness direction Z of the protrusion 14 via a second joint 26. One protrusion 14 of adjacent protrusions 14 is provided to be placed within a region where light from the light emitting element C mounted on the other protrusion 14 reaches. An area of the surface 15 is selected to be equal to an area of a packaging surface 20 facing the protrusion 14 of the element C. <P>COPYRIGHT: (C)2008,JPO&INPIT |
