| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a reliable component built-in printed-wiring board, a manufacturing method of the component built-in printed-wiring board, and electronic equipment of which stable operation can be expected. <P>SOLUTION: In the component built-in printed-wiring board, conductive patterns (component junction electrodes) 11b, 11b for forming an electrode for joining components are buried to a predetermined component packaging surface while a junction surface is exposed on a conductive layer at the inner-layer side of a first base 11. The terminal of a circuit component 20 is joined to the conductive patterns 11b, 11b by solder, and the circuit component 20 is packaged on the component packaging surface of the first base 11. Since the conductive patterns 11b, 11b that become component junction electrodes provided at the component packaging surface of the circuit component 20 are buried to the component packaging surface of the conductive layer at the inner-layer side, the circuit component 20 is packaged on the component packaging surface with nearly no gap between the lower surface of the component and the component packaging surface. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
