发明名称 THREE-DIMENSIONAL CAPACITOR STRUCTURE
摘要 A three-dimensional capacitor structure has a first conductive layer, a second conductive layer disposed above the first conductive layer, and a plug layer disposed between the conductive layers. The first conductive layer includes first conductive closed-end frames, and first conductive islands disposed inside the first conductive closed-end frames. The second conductive layer includes second conductive closed-end frames, and second conductive islands disposed inside the second conductive closed-end frames. The second conductive closed-end frames line up with the first conductive islands, and the second conductive islands line up with the first conductive closed-end frames. The plug layer has plugs disposed in between each first conductive island and each second conductive closed-end frame, and in between each first conductive closed-end frame and each second conductive island.
申请公布号 US2007241425(A1) 申请公布日期 2007.10.18
申请号 US20060468293 申请日期 2006.08.29
申请人 LIN CHIEN-CHIA 发明人 LIN CHIEN-CHIA
分类号 H01L29/00 主分类号 H01L29/00
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