PROCESS FOR PRODUCING RESIN FOR SEMICONDUCTOR LITHOGRAPHY

摘要

This invention provides a process for producing a resin for semiconductor lithography that can suppress the occurrence of defects, particularly bridge mode defects. The process for producing a resin for semiconductor lithography comprises bringing a resin solution (R1) of a resin (A1) for semiconductor lithography, comprising constituent units (a2) containing a lactone-containing cyclic group, dissolved in an organic solvent (S1) into contact with a resin (A1') having a solubility parameter in the range of 17 to 20 (J/cm<SUP>3</SUP>)<SUP>1/2</SUP> and a specific surface area in the range of 0.005 to 1 m<SUP>2</SUP>/g.