发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve the problems of a performance improving technique in the microfabrication of a semiconductor element using an actinic ray or radiation, and to provide a positive photosensitive composition which is improved in pattern collapse, ensures few development defects and excels in various performances such as resolution, isolated DOF and PEB temperature dependency, even in the formation of a fine pattern of &le;100 nm, and a method of forming a pattern using the same. <P>SOLUTION: The positive photosensitive composition includes: a resin whose dissolution rate in an alkaline developing solution increases by the action of an acid, the resin containing a specific acid decomposable repeating unit and a specific acid nondecomposable repeating unit; and a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The method of forming a pattern using the same is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007272194(A) 申请公布日期 2007.10.18
申请号 JP20070012723 申请日期 2007.01.23
申请人 FUJIFILM CORP 发明人 KODAMA KUNIHIKO;YAMAMOTO KEI;TAKAHASHI AKIRA;SUGIMOTO NAOYA
分类号 G03F7/039;C08F220/18;H01L21/027 主分类号 G03F7/039
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