INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit device in which an air isolated crossover is improved using multi-chip module (multi-chip module-MCM) technology.

SOLUTION: An air insulation type crossover interconnection region of the integrated circuit device has a crossover interconnection substrate 51. The crossover interconnection substrate 51 is provided with a contact part which is an under bump metalized layer 58 formed on an interconnection runner 61, and a solder bump 56 interconnection structure which connects at the contact part on a chip.

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