| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve synthetically the processing capability of singulation system from the singulation of a semiconductor package to the receiving of the same into a chip tray. <P>SOLUTION: Cutting blade releasing grooves 21 corresponding to the scheduled partitioning lines 3 of a package base material 17 are formed on the surface of a jig 20 and inject holes 24 are formed by penetrating chip corresponding regions 22 partitioned by the grooves 21 while separable type adhesive agent 25 is provided at a part, around the inject holes 24 and the package base material 17 is contacted thereto, to adhere the substrate 1 of the package base material 17 to the adhesive agent and retain the substrate 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
