| 摘要 |
A method is proposed for producing printed circuit board structures with possible realization options including adhesiveless, flexible and with the smallest via holes with diameters for example of the order of magnitude between 1 and 5 mum. The method is based on a supporting means for the circuit board structure which is still without any copper cladding. The passage holes are shot through or lasered especially for the smallest via holes with the aid of heavy ions or a precision laser in the supporting material provided on its own in this way. The surface of the supporting means is not clad with copper until after this process. When this is done the electrical via holes are contacted simultaneously. If the supporting means is for example flexible polyimide and not yet preprocessed for copper cladding, the surface of the supporting means can be roughened at the same time as the holes are made by controlling the intensity of heavy ion acceleration or the precision laser appropriately. Subsequently the desired circuit board structure is then provided by conventional methods. Furthermore an electronic device unit and the use of a flexible strip conductor film in such a device unit is proposed, with in each case a flexible strip conductor film being used, which is formed with passages through the film which are passages treated at least originally by heavy ion bombardment.
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