| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor light-emitting device having proper transferability. <P>SOLUTION: After fixing a light emitter 10 to a fixture 124, mixed solution 20B is poured to a plentiful degree into the inside of a mold. Then, in a state of applying pressure higher than the atmospheric pressure to the interface of the mixed solution 20B inside the mold, the mixed solution 20B inside the mold is heated and cured so that a sealing part 20 is obtained from the mixed solution 20B. Consequently, for as long as the mixed solution 20B is carrying out contraction curing in the mold, the mixed solution 20B can be pressed against the mold inner wall. <P>COPYRIGHT: (C)2008,JPO&INPIT |
