发明名称 SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a jet soldering apparatus capable of preventing oxidation of a solder in a molten solder tank for flow soldering, which is caused from a driving shaft part for rotating a rotary blade for jetting the solder from a jetting port. SOLUTION: The jet soldering apparatus comprises a rotary blade 7 below the solder level, a driving shaft 6 connected to the rotary blade, and a motor part 4 for rotating the driving shaft. A structure is provided, in which the driving shaft is passed through the bottom plate of a solder tank while sealing the bottom plate. Any contact of the solder with air is eliminated, and the oxidation of the solder caused from the driving shaft part is prevented. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007268606(A) 申请公布日期 2007.10.18
申请号 JP20060124411 申请日期 2006.03.31
申请人 DENPURO:KK 发明人 OKUBO YASUO;OKAJIMA AKINOBU
分类号 B23K1/08;B23K3/06;B23K101/42;H05K3/34 主分类号 B23K1/08
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