发明名称 LAMINATE FOR WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminate for a wiring board which suits with a wiring board used for a transformable part of a mobile phone of a folding type or a sliding type, capable of preventing disconnection of a conductor circuit even in the case of folding repetition, while having practical circuit processability, having electrical reliability and secondary processability such as component mounting and ACF connection, and having sufficient electric capacity of circuits. SOLUTION: The laminate for a wiring board comprises a metal foil layer having thickness of 7-15μm and a tensile modulus of≤40 GPa at 25°C in one side or both sides of a polyimide insulating layer having thickness of 10-15μm and a tensile modulus of≤5 GPa at 25°C. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273766(A) 申请公布日期 2007.10.18
申请号 JP20060098243 申请日期 2006.03.31
申请人 NIPPON STEEL CHEM CO LTD 发明人 TOKUDA YUICHI;TAKEUCHI MASAHIKO;O KOEN
分类号 H05K1/03;B32B15/088 主分类号 H05K1/03
代理机构 代理人
主权项
地址