发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductor which is low in resistivity and has electrically high reliability. SOLUTION: In the conductive paste containing a low melting point metal (A component) containing Sn, a metal (B component) to form this low melting point metal and an alloy, a resin component (C component), and a solvent (D component), a weight blending ratio of the A component against the B component is 60/40≤(A component/B component)≤85/15, the weight blending ratio of the total component of the A component and the B component against the C component is 96/4≤((A component+B component)/C component)≤98/2, and the respective oxygen content of the A component and the B component is 3,000 ppm or less. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273253(A) 申请公布日期 2007.10.18
申请号 JP20060097465 申请日期 2006.03.31
申请人 KYOTO ELEX KK 发明人 MORISHIMA NOBUAKI
分类号 H01B1/22;H05K1/09 主分类号 H01B1/22
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