| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component by which a laminated body can be prevented from deforming and the occurrence of cracks due to a debinder gas can be also prevented, and a laminated electronic component. SOLUTION: When a laminated chip capacitor 1 is manufactured, a ceramic paste containing a binder is used to make a green sheet 13 first. Then an internal electrode layer 10 is formed on the upper surface of the green sheet 13. The internal electrode layer 10 includes a debinder degassing slit 11 which is extended up to the extraction side end of the internal electrode layer 10 in the lengthwise direction of the green sheet 13 and a debinder degassing slit 12 that is connected with the slit 11 and is extended in the vertical direction to the lengthwise direction of the green sheet 13. Then, a step absorption layer 14 is formed on the upper surface of the green sheet 13. The step absorption layer 14 includes a debinder degassing slit 15 connected to the slit 12. After a laminated body is formed, debinder and baking are performed. COPYRIGHT: (C)2008,JPO&INPIT
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