| 摘要 |
The present invention is to provide a laser module that includes a semiconductor laser diode that is raised in a temperature without degrading the heat dissipating efficiency to improve the operation and the performance of the laser diode. The laser module of the invention, having a co-axial package, includes a laser diode, and a heat sink on which the laser diode is mounted. The heat sink also provides a heater on a surface thereof. Supplying a heater current to the heater, the laser diode is raised in a temperature, which improves the operation on the laser diode at a lower ambient temperature.
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