COOLING DEVICE

摘要

A cooling device is provided with a substrate (1) for arranging a semiconductor element (21); a board-like member (2) fixed on the rear surface of the substrate (1); a main tube (11); and an auxiliary tube (12). A first flow channel of a cooling medium is configured by a space sandwiched between the substrate (1) and the main tube (11). A second flow channel of the cooling medium is configured by the main tube (11) and the auxiliary tube (12). The auxiliary tube (12) is arranged to jet the cooling medium toward a region where the semiconductor element (21) is arranged. The second flow channel is separately formed from the first flow channel.