| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method which forms fine pattern of high aspect ratio, that has been incapable of forming by electrolytic copper plating (e.g. subtractive (panel plating)) method. SOLUTION: A printed board 5-1' is electroplated, by using shield plates 9' having holes 21-1 to 21-3, corresponding to holes 22-1 to 22-3 for through-holes of the printed board 5-1' by inhibiting the electroplating current from flowing to the printed board 5-1'. This plating method is effective, especially on a multilayer printed board that is to have a high aspect ratio. COPYRIGHT: (C)2008,JPO&INPIT
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