| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat dissipation structure of an optical module that can effectively establish downsizing and low power consumption of an optical communication module, and to provide an optical communication module. SOLUTION: A heat dissipation structure 1 is provided in an optical module 2 wherein a semiconductor laser element is mounted. The heat dissipation structure 1 includes a pair of heat transmission members 11 and 12 and a frame member 13. The heat transmission members 11 and 12 are respectively provided with heat receiving surfaces 11a and 12a along the side surface 21a of a stem 21 in the optical module 2, and they are facing each other with the stem 21 in between. The frame member 13 couples the heat transmission members 11 and 12. The coefficient of thermal expansion of the frame member 13 is smaller than those of the heat transmission members 11 and 12 and the stem 21. COPYRIGHT: (C)2008,JPO&INPIT
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