| 摘要 |
A light emitting diode structure for a signboard and a manufacturing method thereof are provided to obtain a surface light emitting effect by uniformly emitting light to an epoxy resin layer through a light diffusing agent. A light emitting diode structure(10) for a signboard includes a printed circuit board(110), a semi-transparent or opaque epoxy molding compound layer(150), and an epoxy resin layer(170). At least one light emitting diode(130) is installed on the printed circuit board(110). The epoxy molding compound layer(150) surrounds the printed circuit board(110). The epoxy resin layer(170) surrounds the light emitting diode(130) installed on the printed circuit board(110), is formed on the epoxy molding compound layer(150), and a light diffusing agent is uniformly mixed therein. |
