| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating solution which hardly eludes a ceramic layer when performing the electroless plating on an external electrode of a ceramic electronic component such as a multilayer chip capacitor, and a ceramic electronic component manufacturing method. SOLUTION: The electroless plating solution is used for performing the electroless plating of Ni on an underlaying electrode 4 of a ceramic element 8 constituted of a chip body 3 consisting of a ceramic layer 1 and an internal electrode 2 and the underlaying electrode 4, contains nickel and a reducing agent while the halogen content is≤0.1 mol/L and the pH value is 7-10. A ceramic electronic component 100 is constituted by depositing a Sn plating layer by a known method on a Ni plating layer. COPYRIGHT: (C)2008,JPO&INPIT
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