| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a pressure detecting function and a temperature detecting function integrated in one chip. SOLUTION: The semiconductor device includes a semiconductor substrate 10 having a thick-wall part 10a, and a thin-wall diaphragm 10b to which thinning processing for recessing its one surface side is applied, and whose wall thickness is below that of the thick-walled part, a plurality of piezoresistive elements 14 having piezoelectric effects formed in predetermined regions of the thin-wall diaphragm 10b, and thermocouples 20 each one end of which is made into a hot contact 20c and the other end is made into a cold contact 20d, and which are formed on the other surface side of the semiconductor substrate 10. The cold contact 20d is formed so as to be in the region of the thick-wall part 10a. COPYRIGHT: (C)2008,JPO&INPIT
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