| 摘要 |
Semiconductor device manufacturing equipment is provided to prevent the sliding of a plate for protecting an electrostatic chuck from an electrostatic chuck by locating a protruded portion of the plate on a lift pin hole of the electrostatic chuck. A dome type upper electrode is formed at an upper portion of a process chamber. The upper electrode is applied with an RF power. An electrostatic chuck is used for fixing a wafer opposite to the upper electrode. A plurality of lift pins(118) are installed through the electrostatic chuck to move the wafer up and down. A chuck assembly is installed under the electrostatic chuck. The chuck assembly includes a lower electrode(104) applied with the RF power. A process gas inlet port is used for supplying a process gas into the process chamber. A cleaning gas inlet port is used for supplying a cleaning gas into the process chamber. An electrostatic chuck protecting plate(200) is stably loaded on the electrostatic chuck under a cleaning process on the process chamber. At this time, a protruded portion(202) of the electrostatic chuck protecting plate is inserted into a lift pin hole of the electrostatic chuck.
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