发明名称 A SOFC stack having a high temperature bonded ceramic interconnect and method for making same
摘要 The present disclosure is directed to an integrated SOFC stack including, a first cell having a cathode layer, an electrolyte layer overlying the cathode layer, and an anode layer overlying the electrolyte layer. The SOFC stack also includes a second cell having a cathode layer, an electrolyte layer overlying the cathode layer, and an anode overlying the electrolyte layer. The SOFC stack further includes a ceramic interconnect layer between the first cell and the second cell, the ceramic interconnect layer having a first high temperature bonding region along the interfacial region between the first cell and the ceramic interconnect layer. The ceramic interconnect layer also includes a second high temperature bonding region along the interfacial region between the second cell and the ceramic interconnect layer.
申请公布号 AU2007234833(A1) 申请公布日期 2007.10.18
申请号 AU20070234833 申请日期 2007.04.04
申请人 SAINT-GOBAIN CERAMICS & PLASTICS, INC. 发明人 F. MICHAEL MAHONEY;OH-HUN KWON;WILLIAM J. DONAHUE;JOHN D. PIETRAS
分类号 H01M8/24;H01M8/02;H01M8/12 主分类号 H01M8/24
代理机构 代理人
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