发明名称 |
A SOFC stack having a high temperature bonded ceramic interconnect and method for making same |
摘要 |
The present disclosure is directed to an integrated SOFC stack including, a first cell having a cathode layer, an electrolyte layer overlying the cathode layer, and an anode layer overlying the electrolyte layer. The SOFC stack also includes a second cell having a cathode layer, an electrolyte layer overlying the cathode layer, and an anode overlying the electrolyte layer. The SOFC stack further includes a ceramic interconnect layer between the first cell and the second cell, the ceramic interconnect layer having a first high temperature bonding region along the interfacial region between the first cell and the ceramic interconnect layer. The ceramic interconnect layer also includes a second high temperature bonding region along the interfacial region between the second cell and the ceramic interconnect layer. |
申请公布号 |
AU2007234833(A1) |
申请公布日期 |
2007.10.18 |
申请号 |
AU20070234833 |
申请日期 |
2007.04.04 |
申请人 |
SAINT-GOBAIN CERAMICS & PLASTICS, INC. |
发明人 |
F. MICHAEL MAHONEY;OH-HUN KWON;WILLIAM J. DONAHUE;JOHN D. PIETRAS |
分类号 |
H01M8/24;H01M8/02;H01M8/12 |
主分类号 |
H01M8/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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