发明名称 |
DEVICE PACKAGES HAVING A III-NITRIDE BASED POWER SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a second semiconductor device disposed on the die pad or the substrate, which device may be electrically connected to the III-nitride based device to form a circuit. |
申请公布号 |
WO2006116249(A3) |
申请公布日期 |
2007.10.18 |
申请号 |
WO2006US15376 |
申请日期 |
2006.04.25 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION;PAVIER, MARK |
发明人 |
PAVIER, MARK;CONNAH, NORMAN GLYN |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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