| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate placing stage which is hard to cause an evenness in process at the position corresponding to an insert hole of a lifting pin of a placing stage body when the substrate is subjected to plasma process. SOLUTION: A substrate placing stage 4 on which a substrate G is placed comprises in plasma process a placing stage body 4a, and a lifting pin 30 which is vertically inserted in the placing stage body 4a and supports the substrate by its tip end for lifting. The lifting pin 30 is conductive at least at its tip, and provides an escape position for escaping in the placing stage body 4a when plasma processing, and a support position for protruding from the placing stage body to support the substrate. When at the escape position, the height of its tip is adjusted to be lower than the rear surface of the substrate G by 70-130μm. COPYRIGHT: (C)2008,JPO&INPIT |
