发明名称 MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component of which no breakage occurs from the disruption of an electrode of an internal electrode layer positioned at the outermost layer under a high humidity condition, by improving the electrode coverage of the internal electrode layer positioned at the outermost layer in a stacking direction, with high moisture resistance and excellent temperature characteristics. SOLUTION: The laminated electronic component comprises an element body 10 in which a dielectric layer 2 formed using dielectric paste, and an internal electrode layer 3 formed using conductive paste are alternately stacked. When adding conductive particles and base particles to the conductive paste, the amount of an added base material contained in the conductive paste for forming an internal electrode layer 3a positioned on the outermost side in a stacking direction is set larger than the amount of an added base material contained in the conductive paste for forming the internal electrode layer positioned at the center in the stacking direction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273684(A) 申请公布日期 2007.10.18
申请号 JP20060096781 申请日期 2006.03.31
申请人 TDK CORP 发明人 ITO KAZUE;TANAKA KOJI;TAKAHASHI MAKOTO;YOSHII AKITOSHI;OKABE MASAYUKI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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