发明名称 WIRING STRUCTURE AND FORMING METHOD OF SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring structure having a conductive film of a specified thickness and its forming method which checks the local increase of the current density due to the skin effect in feeding a high frequency current. SOLUTION: The wiring structure made from a conductive film 30 of a specified thickness has an upward swollen convex shape in the cross section to the current flowing direction. It is formed by a step of laying an insulation film 20 along a pattern on a wiring forming region of a board for forming a wiring in a specified pattern of the conductive film 30, a step of swelling the upside of the laid insulation film 20 to form an upward convex surface, a step of forming the conductive film 30 of the specified thickness on the upside of the board, and a step of patterning the formed conductive film. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273670(A) 申请公布日期 2007.10.18
申请号 JP20060096553 申请日期 2006.03.31
申请人 SONY CORP 发明人 NAKAMURA MITSUHIRO
分类号 H01L21/822;H01L21/3205;H01L23/52;H01L27/04 主分类号 H01L21/822
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