发明名称 |
WOVEN CLOTH FOR WIRING BOARD, AND PREPREG |
摘要 |
PROBLEM TO BE SOLVED: To provide a woven cloth for a wiring board and a prepreg which are a precursor of a wiring board having a high density wiring and a high connection reliability and stacking reliability. SOLUTION: A single fiber has such a wave-like shape as to correspond to a pitch in which the woven cloth for a wiring board is woven. The length of the single fiber corresponding to one cycle of the wave-like shape is larger than 1 times and not more than 1.20 times of the cycle of the wave-like shape, resulting in reducing a spring effect of the single fiber. Consequently, there is no separation of a resin in the interface and an effect of reducing a coefficient of thermal expansion is increased. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2007273632(A) |
申请公布日期 |
2007.10.18 |
申请号 |
JP20060095823 |
申请日期 |
2006.03.30 |
申请人 |
KYOCERA CORP;ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
GONDO YOSHINOBU;YOSHIKAWA SHINJI;HAYASHI KATSURA;TSUKADA YUTAKA;SHIRAI MASAHARU |
分类号 |
H05K1/03;C08J5/24;H01L23/14 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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