| 摘要 |
A sputtering target having at least one flat first sputtering surface and at least one second sputtering surfaces respectively and laterally abutted against the flat first sputtering surface and slanting in one direction relative to the first sputtering surface. By means of adjusting the position of the second sputtering surface related to the first sputtering surface and utilizing the differently slanted second sputtering surface of the sputtering target, the distribution of the thin film deposited on the surfaced of a substrate is relatively controlled and a uniform thickness of the thin film is obtained.
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