COMPOSITION FOR POSITIVE TYPE PHOTORESIST

摘要

A positive photoresist composition is provided to improve the plating resistance in a metal plating process under a strong alkali condition and to prevent the loss of a metal such as silver, thereby reducing the manufacturing cost of a metal electrode. A positive photoresist composition comprises 100 parts by weight of an alkali-soluble resin; 30-80 parts by weight of a photosensitive compound; 10-30 parts by weight of a thermosetting resin; 3-15 parts by weight of a sensitivity enhancer; and 30-120 parts by weight of a solvent. Preferably the thermosetting resin is a methoxymethylmelamine-based resin; the alkali-soluble resin is an alkali-soluble cresol novolac resin having a weight average molecular weight of 2,000-30,000; and the photosensitive compound is a diazide-based compound.