| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a noncontact communication medium capable of precisely controlling a sealing form and sealing thickness of an IC chip for improvement in a reinforcement function of the IC chip. <P>SOLUTION: In an IC card 11 or an antenna module 14 (a noncontact communication medium), adhesion of reinforcement plates 17A and 17B to the IC chip 13 is carried out via thermosetting adhesive films 16A and 16B, and consequently, evenness of adhesion height and the sealing form of the reinforcement plates 17A and 17B to the IC chip 13 is increased for stabilizing quality. As the adhesion height of the reinforcement plates 17A and 17B can be controlled by the film thickness of the adhesive films 16A and 16B, the sealing thickness of the IC chip 13 can be reduced without damaging the IC chip 13, while the reinforcement function of the IC chip 13 can be improved when the plate thickness of the reinforcement plates 17A and 17B is increased. <P>COPYRIGHT: (C)2008,JPO&INPIT |
