发明名称 METHOD FOR MANUFACTURING FLEXIBLE FILM AND MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board and a manufacturing device which utilizes maximally a reel to reel manufacturing device by splicing a single sheet flexible film to lengthen without increasing the process for a high precision circuit board manufactured by sticking a single sheet flexible film to a stiffening plate while maintaining accuracy, thereby simplifying the grip of starting point of exfoliation of the single sheet flexible film. SOLUTION: The method for manufacturing the circuit board and the manufacturing device is characterized in that it splices flexible films which are on a plurality of members for circuit board in the direction of exfoliation by using two or more of the members for circuit board in which a circuit pattern is formed in the opposite side to the laminated side of a flexible film 1 laminated on a single sheet type stiffening plate 3 through an exfoliable organic layer 2, and the flexible film is exfoliated from the stiffening plate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273701(A) 申请公布日期 2007.10.18
申请号 JP20060097168 申请日期 2006.03.31
申请人 TORAY IND INC 发明人 TOMABECHI SHIGENAO;OKUYAMA FUTOSHI;KUROKI NOBUYUKI
分类号 H01L21/60;H05K3/00 主分类号 H01L21/60
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