| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an upper surface plate and a lower surface plate uniformizing a polishing amount to polish without causing surface sag. <P>SOLUTION: The polishing device has the upper surface plate 10 and the lower surface plate 11, clamps a carrier 11 between the upper surface plate and the lower surface plate, inputs a workpiece 1 in the hole of the carrier, and polishes with abrasive grains. The upper surface plate and the lower surface plate are made of hard resin, and composed of a porous plate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
