| 摘要 |
PROBLEM TO BE SOLVED: To provide a flaw detection method, capable of surely detecting only the flaw of a substrate in an inspection target which includes the substrate and the constituent member arranged on the substrate, and can visually confirm the constituent member, from the side opposite to the constituent member that is the arranged side via the substrate. SOLUTION: The flaw detection method is constituted so as detect the flaw of the substrate in the inspection target which contains the substrate and the constituent member, arranged on the substrate and can visually confirm the constituent member from the side opposite to the constituent member arranged side via the substrate and has an illumination process for irradiating the surface of the substrate that is the inspection target, with the illumination light from the side opposite to the constituent member arranged side; an imaging process for detecting only a specific wavelength region of the light, obtained from the surface of the substrate to photograph the surface of the substrate; and a detection process for detecting the flaw of the substrate from the photographed image of the surface of the substrate or the photographed image, after predetermined correction processing has been applied to the photographed image. The specific wavelength region is a wavelength band, wherein the quantity of reflected light obtained from the surface of the substrate is larger than the quantity of reflected light obtained from the constituent member. COPYRIGHT: (C)2008,JPO&INPIT
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