发明名称 METHOD FOR FLATTENING GLASS SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve the flatness of a surface of a glass substrate when the substrate has recessed parts such as fine scratches on the surface thereof. SOLUTION: A first etching liquid having an etching rate to the glass substrate of not less than 0.01μm/min and less than 5μm/min and a second etching liquid having an etching rate to the glass substrate of not less than 5μm/min and not greater than 15μm/min are prepared as etching liquids. When an etching process is performed firstly using the first etching liquid having the slow etching rate, the recessed parts as well as the surface of the glass substrate can be removed while preventing the recessed parts from growing particularly in the thickness direction. When an etching process is performed successively using the second etching liquid having the rapid etching rate, the surface of the glass substrate can be further more flattened. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007269619(A) 申请公布日期 2007.10.18
申请号 JP20060165580 申请日期 2006.06.15
申请人 CASIO COMPUT CO LTD;SANWA FROST INDUSTRY CO LTD;NAGASE & CO LTD 发明人 HIROKI KAZUYUKI
分类号 C03C15/02;G02F1/1333 主分类号 C03C15/02
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